Packaging Innovations Warsaw 2017

We are excited to announce our participation during the 9th International Packaging Innovations Trade Show from 4th and 5th of April 2017, at EXPO XXI in Warsaw Poland.

Continuing with success our international expansion, we will be present at our appointed re-seller’s stand – Reprograf S.A. -, showcasing Overprint MIS for the packaging and labeling industries.

We will be looking forward welcoming you at stand C40 to discuss and address industry’s challenges and requirements.

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